| 摘要 |
PURPOSE:To prevent internal voids and to improve damp-proofing by forming at least one resin outflow section into a lead frame. CONSTITUTION:A semiconductor element 6 is connected to external leading-out leads 3 for a lead frame 1 by connector wires 7, tub leads 5 holding a tub 4 are connected to an outer frame 2, and resin outflow sections 8 are shaped to the outer frame 2, avoiding connecting positions among the tub leads 5 and the outer frame 2. When the semiconductor element is sealed by a thermosetting resin, voids are easy to remain in a down-stream side inside 10 in a sealed cavity 9, but burrs 11 are projected to the resin outflow sections 8 for the outer frame 2, thus drawing out the voids to the outside of the cavity 9. Accordingly, internal voids can be prevented, and the damp-proofing property of a semiconductor device after resin sealing can be improved. |
