| 摘要 |
PURPOSE:To prevent a melted bonding metal from flowing out by inclining toward the inside the upper surface of a jig supporting plate positioning annular unit used in case of bonding a semiconductor substrate to a metal supporting plate by alloying or brazing method. CONSTITUTION:A positioning carbon ring 2 is filled in a vessel 1, and a molybdenum plate 3 is engaged within the hole. A silicon substrate 5 is superposed through an aluminum foil 4 of an alloying material on the plate 3. Carbon powder 6 is filled thereon, a retainer 7 is placed on the powder 6 to pressurize it. In this case, a flat upper surface 8 inclined so that the outer periphery becomes thicker than the bore is formed at the ring 2, thereby filling it outside the plate 3 in high density when pressurizing the powder 6 by the retainer 7 after filling the powder 6. Accordingly, a gap for allowing the melted aluminum to flow out is eliminated. |
