| 摘要 |
PURPOSE:To decrease distortion in input/output signals in a high frequency test of a semiconductor chip and to obtain the accurate result of inspection, by providing a microstrip line structure over the entire surface of an input wiring and an output wiring. CONSTITUTION:By using a three-layer printed wiring board 11, the central conductor layer is made to be a grounding wiring 14. Printed wirings 12 are provided at the upper and lower layers. The printed wirings 12 and 12' are connected at the end of the inner side, which defines a central hole. An input signal is applied to the outer end of the upper layer of the printed wirings 12a (12 and 12') having a microstrip line structure from an input signal source 10. The signal is returned in the vicinity of a probe 13a and terminated at an input terminating resistor 22 at the outer end of the lower layer of the printed wirings 12a. The resistance value of the resistor 22 is equal to the characteristic impedance of the printed wirings 12a. An output signal is made to pass the printed wirings 12b having the microstrip line structure through a probe 13b and terminated at an output terminating resistor 23, whose resistance value is equal to the characteristic impedance of the printed wirings 12b.
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