| 摘要 |
PURPOSE:To realize thermal consistency, a change into low thermal resistance and a change into a high-density grid, and to improve the reliability of an IC package by mounting a high thermal conductive material to a die stage for the IC package using a printed board s a base material. CONSTITUTION:A printed board 11 has the multilayer structure of heat-resisting glass epoxy/BT resin/polyimide/copper core material, and a high thermal conductive material 13 is bonded with a die stage 14 by an epoxy group bonding resin 20. On the other hand, an IC chip 12 is bonded with the high thermal conductive material 13 by silver paste 21. When heat is generated in the IC chip 12, the high thermal conductive material 13 absorbs the heat of the IC chip, thus preventing a transmission as it is over the printed board 11 of the heat of the IC chip. When the IC chip 12 is expanded or contracted by a heat cycle, the high thermal conductive material is expanded or contracted together with the IC chip, thus obviating the application of stress to the IC chip. SiC, AlN, BN, BeO, Cu, etc. are sued as the high thermal conductive material.
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