| 摘要 |
The invention relates to a method for producing printed circuit boards for electrical and electronic circuits, comprising an electrically non-conductive substrate and electrically conductive paths applied thereon, wherein the electrically conductive paths are printed onto the substrate according to the desired conductor path layout under the influence of heat. The invention also relates to a device for producing printed circuit boards for electrical and electronic circuits, comprising an electrically non-conductive substrate and electrically conductive paths applied thereon, comprising a printing head for the selective heating of an electrically conductive printing medium according to the desired conductor path layout, in order to transfer this printing medium onto the substrate. |
