| 摘要 |
PURPOSE:To enable the outside terminals of grids to be remarkably curtailed by extending stripe-shaped grid electrodes so as to integrally form also an IC lead frame electrode section used for loading grid drivers, from an extremely thin plate through photoetching technics. CONSTITUTION:Grids 20 are formed by subjecting an extremely thin plate of alloy to the process of etching it in thin stripe shape, and an electrode section 30 used for loading a grid driver IC is integrally formed on one end thereof. The electrode section 30 comprises an IC output side lead 31, an IC input side lead 32 and an IC tip diebond lead 33 that are integrally connected to the grid 20. Meanwhile, respective stripe-shaped grid electrodes are firstly mechined in a state of connection like ladder shaped portions 34, 35 so as to hold mechanical strength thereof. The ladder shaped portions 34, 35 are cut off 37 to be electrically isolated by laser beams after being provisionally fixed by means of spacer glass 14 and frit glass 4.
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