发明名称 Resin production method and resin production apparatus
摘要 Provided is a resin production method in which a mold release force applied between a mold and a curable resin is reduced in a resin production method using a nano-imprint method. The resin production method includes an arrangement step of arranging a curable composition (1) on a substrate (2); a contacting step of bringing a mold (3) into contact with the curable composition (1); a curable composition curing step of curing the curable composition (1) by irradiating the curable composition (1) with a radiation or heating the curable composition (1) while keeping the curable composition (1) in contact with the mold (3); a tensile stress generation step of generating a tensile stress (6) in a direction of spacing the substrate (2) and the mold (3) away from each other to such a degree that the mold (3) and the curable composition (1) are not spaced away from each other when the curable composition (1) is cured; and a mold release step of releasing the curable composition (1) and the mold (3) from each other.
申请公布号 US9475229(B2) 申请公布日期 2016.10.25
申请号 US201314402962 申请日期 2013.07.17
申请人 CANON KABUSHIKI KAISHA 发明人 Iida Kenichi;Ito Toshiki;Matsufuji Naoko;Suzuki Tatsuya
分类号 B29C59/02;G03F7/00;G03F7/027;B29K105/00 主分类号 B29C59/02
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A resin production method for producing a resin having a predetermined pattern by curing a radiation curable composition while keeping a mold having a predetermined depressed and projected pattern on a surface thereof and the radiation curable composition in contact with each other, the method comprising: an arrangement step of arranging the radiation curable composition on a substrate; a contacting step of bringing the mold into contact with the radiation curable composition; a radiation irradiation step of irradiating the radiation curable composition with a radiation while keeping the radiation curable composition in contact with the mold; a tensile stress generation step of generating, while subjecting the radiation curable composition to radiation irradiation, a tensile stress by increasing a relative distance between the mold and the substrate without separating the mold from the radiation curable composition; and a mold release step of releasing a cured composition and the mold from each other, wherein the mold release step is started after the tensile stress generation step.
地址 Tokyo JP