发明名称 |
Resin production method and resin production apparatus |
摘要 |
Provided is a resin production method in which a mold release force applied between a mold and a curable resin is reduced in a resin production method using a nano-imprint method. The resin production method includes an arrangement step of arranging a curable composition (1) on a substrate (2); a contacting step of bringing a mold (3) into contact with the curable composition (1); a curable composition curing step of curing the curable composition (1) by irradiating the curable composition (1) with a radiation or heating the curable composition (1) while keeping the curable composition (1) in contact with the mold (3); a tensile stress generation step of generating a tensile stress (6) in a direction of spacing the substrate (2) and the mold (3) away from each other to such a degree that the mold (3) and the curable composition (1) are not spaced away from each other when the curable composition (1) is cured; and a mold release step of releasing the curable composition (1) and the mold (3) from each other. |
申请公布号 |
US9475229(B2) |
申请公布日期 |
2016.10.25 |
申请号 |
US201314402962 |
申请日期 |
2013.07.17 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Iida Kenichi;Ito Toshiki;Matsufuji Naoko;Suzuki Tatsuya |
分类号 |
B29C59/02;G03F7/00;G03F7/027;B29K105/00 |
主分类号 |
B29C59/02 |
代理机构 |
Fitzpatrick, Cella, Harper & Scinto |
代理人 |
Fitzpatrick, Cella, Harper & Scinto |
主权项 |
1. A resin production method for producing a resin having a predetermined pattern by curing a radiation curable composition while keeping a mold having a predetermined depressed and projected pattern on a surface thereof and the radiation curable composition in contact with each other, the method comprising:
an arrangement step of arranging the radiation curable composition on a substrate; a contacting step of bringing the mold into contact with the radiation curable composition; a radiation irradiation step of irradiating the radiation curable composition with a radiation while keeping the radiation curable composition in contact with the mold; a tensile stress generation step of generating, while subjecting the radiation curable composition to radiation irradiation, a tensile stress by increasing a relative distance between the mold and the substrate without separating the mold from the radiation curable composition; and a mold release step of releasing a cured composition and the mold from each other, wherein the mold release step is started after the tensile stress generation step. |
地址 |
Tokyo JP |