| 摘要 |
PURPOSE:To form a rugged copper plating layer having excellent adhesiveness on the surface of a heat transmission member by specifying a current rate in the stage of forming the rugged plating layer on the surface of the heat transmission member by an acidic cupper sulfate plating liquid added with an oxyethylene surface active agent and chlorine ions. CONSTITUTION:A masking member 17 is inserted and fixed to a cap 12 at inside surface end 18 of the heat transmission member 2' for a heat exchanger fitted and fixed with radiation fins 3 and is combined with a circulating pump 13 so that the plating liquid 9 in a plating cell 7 is circulated in the member 2'. The acidic cupper sulfate plating liquid added with the oxyethylene oleyl ether and hydrochloric acid is used for the plating liquid 9. Electricity is conducted from a DC power source 14 to an anode bar 15 inserted into the member 2' and a connecting terminal 16 to execute plating. The plating is executed in a >=20Xx(A/dm<2>) and <=40Xx(A/dm<2>) range if the concn. of the chlorine ions in the plating liquid is designated to be x millimol. The rugged copper plating layer having the excellent adhesiveness is thereby formed on the inside surface of the member 2' and the heat exchanger having a high effect of accelerating transmission of boiling heat is obtd.
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