发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To obtain a film of a uniform thickness by sputtering by extending a circular magnetic field region formed over the surface of a target on both sides of a base material in the lateral direction so as to make the amount of metallic particles flying from the target uniform over the whole region of the base material. CONSTITUTION:A target 28 is placed opposite to a base material 22 traveling in a vacuum vessel 21. Magnets 34, 35 having different polarities are arranged on the rear side of the target 28 so that a circular magnetic field region 75 is formed between the magnets 34, 35. At this time, the area of each of parts of the region 75 on both sides of the base material 22 in the lateral direction is made larger than the area of the remaining part.
申请公布号 JPS62185873(A) 申请公布日期 1987.08.14
申请号 JP19860025743 申请日期 1986.02.10
申请人 TORAY IND INC 发明人 ABE KAZUHIKO;OGAWA MASAYUKI
分类号 H01L21/285;C23C14/35;C23C14/36;H01L21/203 主分类号 H01L21/285
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