EPOXY RESIN MOLDING MATERIAL FOR SEALING

摘要

PURPOSE:To form an epoxy resin molding material for sealing which is excellent in moisture resistance, moldability and low stress, by adding a silicone resin powder and a modified silicone intermediate to an epoxy resin. CONSTITUTION:An epoxy resin molding material for sealing contains a silicone resin powder and a modified silicone intermediate. Pref. the silicone resin powder has a max. particle size of not larger than 100mu and is used in an amount of 1-50pts.wt. per 100pts.wt. epoxy resin. The modified silicone intermediate is an amino-modified one and is used in an amount of pref. 1-50pts.wt. per 100pts.wt. epoxy resin.