| 摘要 |
Provided is a laminate with which excellent processability of a device wafer can be achieved, even if the circuit surface of the device wafer is covered with a moulding material, and a temporary adhesive layer is subsequently provided to the surface to bond the device wafer and a carrier substrate together. This laminate is provided with: a device wafer having a circuit surface; a moulding layer which covers the circuit surface; and a temporary adhesive layer positioned on the surface of the moulding layer. The number of voids having a maximum length of at least 30 µm when observed from a direction orthogonal to the film surface of the temporary adhesive layer using an optical microscope is not more than 3 per 700 cm2 of the film surface of the temporary adhesive layer. The arithmetic average surface roughness Ra of the temporary adhesive layer satisfies Ra ≤ 10 µm. |
