| 摘要 |
PURPOSE:To rapidly and accurately inspect the bending and positional shift of a large number of leads, by irradiating the leading end parts of LSI leads with a slit beam and catching the reflected beams thereof by an ITV camera and confirming the pattern of the image thereof to inspect the leads. CONSTITUTION:For example, a semiconductive package 11 is a flat package having at least 48 lead wires mounted to one side thereof and LSI is received therein. At the time of inspection, the semiconductive package is arranged on a test stand 18. A slit beam 16 is parallel one constant in a width and a direction and obtained, for example, by arranging a beam source at the focus of a convex lens and the leading end parts 12a of the LSI lead wires 12 are irradiated with said beam. The reflected beams 17 reflected from the leading end parts 12a of the lead wires 12 at this time are caught by an industrial ITV camera 15 to perform the confirmation processing of a pattern and the bending and positional shift of the lead wires 12 in before-and-behind, left-and- right and up-and-down directions can be detected accurately and rapidly.
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