| 摘要 |
PURPOSE:To prevent lowering of the electron emitting performance by interposing, between a cathode base and a cup, a binding material wherein a porous member comprising a high melting point metal is impregnated with a soldering material comprising an alloy including platinum or platinum group, heating the binding material to melt the soldering material, and fixing together the cathode body and the cup. CONSTITUTION:A soldering material of Mo-Ru kneaded with an organic binder is applied to the cup 2 side surface of a sintered body 6 for a binding material 7. Then, it is pushed to the bottom of the cup 2 to be closely fitted thereto, and heated at a temperature about 2,000 deg.C in a reducing atmosphere. Further, the sintered body 6 is impregnated with a Mo-Ru binding material 7 to form the binding material 8, while the sintered body 6 is fixed to the cup 2. Next, a sintered body 9 for a cathode body 10 is pushed into the cup 2, and heated at 2,000 deg.C in a reducing atmosphere for a few seconds, to consolidate the sintered body 9 and the cup 2 into one body with the binding material 8. And, the sintered body 9 is impregnated with an electron emitting substance at the temperature around 1,800 deg.C in the reducing atmosphere to eliminate an excessive electron emitting substance, forming a cathode body 10. Thus, lowering of the electron emitting performance is prevented.
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