Heater device

摘要

Heater device suitable for heating a fluid such as air to be contacted with a printed circuit board for melting solder or the like thereon. The device comprises two heat exchange elements having at least one passage through which fluid to be heated passes. A stainless steel etched foil heater is disposed in a plane between the first and second heat exchange elements, and a fluid entry port is provided in flow communication with the first and second heat exchange elements for admitting fluid to be heated into the at least one passage. A fluid exit port is provided in flow communication with the at least one passage for passing heated fluid from the passage to the substrate to melt the solder or the like thereon. The fluid entering through the fluid entry port and exiting through the fluid exit port flows in generally the same direction as the plane of the heater.