发明名称 INSPECTING METHOD FOR CIRCUIT BOARD
摘要 PURPOSE:To eliminate damage to an electrode to be measured and to perform inspection securely even if a circuit board is curved or strained by pressing an elastic body against a flexible substrate for measurement and thus bringing the substrate into contact with the electrode to be measured. CONSTITUTION:The substrate 3 is positioned above the circuit board 1 while a proper gap D is left, and the electrode 2 to be measured on the circuit board 1 and the measurement electrode 5 on the substrate 3 for measurement are positioned opposite each other by using a microscope 9. While the substrate 3 for measurement is stopped, a pressure piece is pushed and moved by a pushing means which is not shown in a figure to press the position where the measurement electrode 5 of the substrate 3 for measurement toward the circuit board 1 across the elastic body 7. Then, the arrangement position of the measurement electrode 5 of the substrate 3 for measurement is pushed by the pressure piece 8 across the elastic body 7 and displace toward the circuit board 1, and the measurement electrode 5 contacts the electrode 2 to be measured to obtain mutual conduction, thereby performing the specific inspection of the circuit board 1.
申请公布号 JPS62233774(A) 申请公布日期 1987.10.14
申请号 JP19860077139 申请日期 1986.04.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 INAGAKI NORIYUKI;MAKINO YUTAKA;HAMAUCHI CHIKAICHI;KAWASAKI KIYOHIRO;KINOSHITA HIROSHI
分类号 G01R31/00;G09F9/30 主分类号 G01R31/00
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