| 摘要 |
PURPOSE:To conduct positioning with high precision by forming a guide mark for positioning to an arbitrary section on an insulating film to which a lead is not shaped. CONSTITUTION:Copper foil tapes 5 are slit and cladded on a polyimide film (with a device hole and a sprocket hole) by adhesives, and a film carrier 1 in which predetermined leads and the copper foil patterns of cross-shaped guide marks 7 are shaped through a photoetching method is prepared. Inner leads are bonded with an IC chip 9 by a full automatic inner-lead bonder, using the guide marks 7 as indices to the film carrier 1. Accordingly, positioning having high accuracy can be performed, thus improving the yield of the bonding of the inner leads, then enhancing the reliability of electrical connections.
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