| 摘要 |
PURPOSE:To properly attach a radiator to a high-frequency high-output hybrid integrated circuit and thereby to prevent high-frequency signal transmission loss from increasing by a method wherein a portion void of a bonding agent between a radiator and grounding conductor is formed to continuously surround a through-hole in an insulating substrate. CONSTITUTION:An insulating substrate 1 is furnished with a through.hole 3, conductive pattern covering its front surface, and grounding conductor 2 covering roughly the entirety of its rear surface. A heat sink 6 is furnished with a power semiconductor element 5 fixed to its upper surface. The heat sink 6 is so caused to enter the through- hole 3 that the lower surface of the heat sink 6 may roughly flush with the grounding conductor 2. A radiator 8 is bonded, electrically and mechanically, to the grounding conductor 2 and the Iower surface of the heat sink 6 with a bonding agent agent 7'', 7'. A portion void of the bonding agent 7'', 7' between the radiator 8 and grounding material 2 is formed to continuously surround the through-hole 3. For example, a glass pattern 4 on the surface of the grounding conductor 2 around the through-hole 3 provided in the insulating substrate 1 is so formed as to continuously surround the through.hole 3. |
