发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To increase the space using efficiency by a method wherein multiple circuit blocks and probe connecting pads connected to multiple circuit blocks used for testing respective circuit blocks are provided on a substrate while a part of the pads are common-connected to multiple circuit blocks. CONSTITUTION:A part of probe connecting pads 3 is removed and instead another pad 3a similar to the pad 3 and an interconnection 4 are additionally provided. The removed pad 3 to be the potential of respective substrate 1 out of the potentials incident to respective circuit blocks 2 is a power supplying pad in case the circuit block 2 is a CMOS. The removed pad 3 is common- connected to the pad 3a through the intermediary of the interconnectlon 4. Through these procedures, this integration can eliminate the mutual interference in the circuit blocks 2 in case of testing respective circuit blocks 2 while decreasing the total numbers of pads 3 and 3a less than those of conventional constitution to increase the space using efficiency of substrate 1.
申请公布号 JPS62235744(A) 申请公布日期 1987.10.15
申请号 JP19860079545 申请日期 1986.04.07
申请人 FUJITSU LTD 发明人 TSUCHIYA SHINPEI
分类号 H01L21/66;G01R31/26;H01L21/822;H01L27/04 主分类号 H01L21/66
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