| 摘要 |
PURPOSE:To easily confirm the directivity of a semiconductor substrate by a method wherein two points where the edge of the substrate makes the circumference of the semiconductor substrate are formed at different angles with each other for the tangential lines at the two points. CONSTITUTION:A notch 102 is provided on a semiconductor substrate 101 for discrimination of directivity. The notch 102 is connected with the circumference 107 of the substrate 101 and the two points 103 and 104. The notch 102 is cut at angles 108 and 109 which are different from the tangential lines 105 and 106 of the two points 103 and 104. As a result, the directivity of the substrate 101 can be confirmed easily.
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