发明名称 HEAT PUMP APPARATUS
摘要 A heat pump apparatus includes a heat source-side refrigeration cycle sequentially connecting a compressor, a heat source-side heat exchanger, an expansion valve, and a heat source side of a cascade heat exchanger, and configured to circulate refrigerant, and a load-side refrigeration cycle sequentially connecting a heat medium sending unit, a load-side heat exchanger, and a load side of the cascade heat exchanger, and configured to circulate a heat medium. The heat source-side heat exchanger and the cascade heat exchanger each have an equivalent diameter of less than 1 mm, which is calculated by 4×S/L, where S represents a cross-sectional area of a fluid passage and L represents a length of a wetted perimeter.
申请公布号 US2016320105(A1) 申请公布日期 2016.11.03
申请号 US201415108664 申请日期 2014.01.23
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 OKAZAKI Takashi
分类号 F25B25/00;F25B13/00 主分类号 F25B25/00
代理机构 代理人
主权项 1. A heat pump apparatus, comprising: a heat source-side refrigeration cycle sequentially connecting a compressor, a heat source-side heat exchanger, an expansion valve, and a heat source side of a cascade heat exchanger, the heat source-side refrigeration cycle being configured to circulate refrigerant; and a load-side refrigeration cycle sequentially connecting a heat medium sending unit, a load-side heat exchanger, and a load side of the cascade heat exchanger, the load-side refrigeration cycle being configured to circulate a heat medium, the refrigerant being flammable refrigerant or slightly flammable refrigerant, the heat source-side heat exchanger and the cascade heat exchanger each having an equivalent diameter of less than 1 mm, which is calculated by 4×S/L, where S represents a cross-sectional area of a fluid passage and L represents a length of a wetted perimeter.
地址 Tokyo JP