| 摘要 |
PURPOSE:To provide the titled composition containing an epoxy resin, a specific carboxylic acid anhydride, a polymerizable vinyl monomer, a radial polymerization initiator and a specific cure accelerator, exhibiting low viscosity at room temperature, having excellent workability and processability and suitable as a material for copper-clad laminated. CONSTITUTION:The objective composition contains, as essential components, (A) an epoxy resin, (B) a carboxylic acid anhydride free from ethylenic unsaturated bond (preferably glycerol tristrimellitate, etc.), (C) a polymerizable vinyl monomer (e.g. styrene), (D) a radical polymerization initiator [e.g. 2,5- dimethyl-2,5-di(t-tubylperoxy)hexane] and (E) an epoxy resin cure accelerator containing an onium salt of formula (Z is H or P; R<1>-R<4> are organic group provided that at least one of R<1>-R<4> is >=14C group; X is organic or inorganic acid ion; n is atomic valence of X ion) (e.g. tetradecyl dimethylbenzyl ammonium chloride).
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