| 摘要 |
PURPOSE:To provide a resin compsn. which has excellent heat resistance and can be cured at a relatively low temp., consisting of a polystyrylpyridine resin and a vinyl ester resin. CONSTITUTION:An arom. dialdehyde derivative is polycondensed with a pyridine derivative having at least two reactive methyl groups at the 2, 4 or 6-position to obtain a polystyrylpyridine resin (A) of formula I (wherein X is a group of formula II; Y is a group of formula III; Z is a group of formula IV; R and R1 are each a hydrocarbon group which may have a hetero atom; A and A1 are each a sterically migrating bonding group such as an ether or sulfone group and an atom or a group capable of forming a bridge between the arom rings of a styrylpyridine chain together with R and R1; R2 is H, methyl or ethyl; k, l, m are each an integer including zero and at least one thereof is not zero). The compound A is blended with a vinyl ester resin (B) and optionally, 0-60wt% other resin (C) (e.g., a phenolic resin) and 5-98wt% filler (D) (e.g., glass fiber).
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