发明名称 MANUFACTURE OF WAFER INTEGRATED CIRCUIT
摘要 PURPOSE:To obtain a manufacturing method in which the number of masks to be used is reduced and a range of common steps is increased by forming connecting wirings of first direction and an insulating film, forming contact holes based on the layout of wirings for connecting unit circuits of good product, and forming connecting wirings of second direction to be connected with the wirings of the first direction. CONSTITUTION:When forming a plurality of unit circuits for forming circuit blocks 11-13 having in redundancy the unit circuits of the same configuration, connecting wirings 21-24 of first direction and insulating films covered on the wirings are formed between the unit circuits. Then, the plurality of unit circuits are inspected to select the unit circuits of good product, the layout of the connecting wirings for connecting the selected good unit circuits is defined, and contact holes 31-34 for connecting with the wirings 21-24 of the first direction are formed in the insulating films based on the layout. Then, connecting wirings 41-43 of second direction are formed between the unit circuits to be connected with the wirings 21-24 of the first direction through the holes 31-34, thereby forming the wirings coincident with the layout.
申请公布号 JPS62272553(A) 申请公布日期 1987.11.26
申请号 JP19860116408 申请日期 1986.05.20
申请人 FUJITSU LTD 发明人 TSUCHIYA SHINPEI;YAMASHITA KOICHI
分类号 H01L21/82;H01L21/822;H01L27/04 主分类号 H01L21/82
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