| 摘要 |
PURPOSE:To provide an adhesive comprising a specified polyether imide, which functions at relatively low temperatures and has excellent adhesion characteristics at high temperatures without causing variability in adhesiveness. CONSTITUTION:A polyether imide having a repeating unit represented by formula I [wherein R represents a divalent group selected from among a 6-20C aromatic hydrocarbon group or its halogenated derivatives, alkylene, polyorganosiloxane chain-stopped with a 2-8C alkylenes, 3-20C cycloalkylene, a group of formula II (wherein X represents -O-), formula III, formula IV, -S-, -CnH2n-; m is 0, 1; n is 1-5] is formed into a filmy shape to obtain a filmy adhesive of 30-150mum in thickness. Subsequently said adhesive is put between adherends and set by applying a pressure of at least 1kg/cm<2> thereon. Then the adherends are bonded to each other by heating the adhesive at a temperature of 230 deg.C or above.
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