摘要 |
PURPOSE:To remove only abnormal semiconductor devices accurately, by measuring constant current and voltage values in the forward direction at junctions through external lead wires, computing the difference between the individual measured value and the average value of the measured values in the population of the same manufacturing lot, comparing the computed value with a standard value, thereby judging the quality. CONSTITUTION:A semiconductor element is bonded to a substrate supporting body. Each electrode of the semiconductor element is connected to an external lead wire with a thin metal wire. The constant current and voltage values in the forward direction at a junction are measured through the external lead wire. Based on the difference between the individual measured value and the average value of the measured values of the population of the same manufacturing lot, the defective individual measured values are detected. The distribution of the forward voltage (VBE) for every manufacturing lot is estimated by the measurements of a small amount of samples. The average value of the VBE of said manufacturing lot is obtained. A standard value is provided with respect to the average value. Then the dispersion in VBE among the manufacturing lots can be offset. The abnormal dispersion, which is yielded in the manufacturing processes can be detected accurately.
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