| 摘要 |
PURPOSE:To provide the title compsn. suitable for use in bonding printed wiring boards and having excellent adhesion, solderability and electrical characteristics such as tracking resistance, etc., containing a polyvinyl butyral resin, a melamine resin and a phenoxy resin in a specified ratio. CONSTITUTION:30-60wt% polyvinyl butyral resin (A) having a degree of butyralization of 60-65mol% and a degree of polymn. of 1,000-2,000, 20-50wt% melamine resin (B) such as a butylated melamine resin, a guanamine resin, etc., and 20-50wt% phenoxy resin (C) are dissolved in an org. solvent (D) such as an alcohol, a ketone, etc. The resulting resin soln. is reacted and co-condensed to obtain the title compsn. mainly composed of a polyvinyl butyral resin/melamine resin/phenoxy resin co-condensate.
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