| 摘要 |
A low-profile, conductive lead socket for insertion into a plated-through hole or conductive sleeve to receive a component lead inserted therein. The socket includes a cylindrical portion with upper and lower axial openings and a plurality of compliant fingers which extend from the lower opening to engage the inserted lead. The circumference of the socket frictionally engages the bore of the hole to establish electrical continuity between the lead and sleeve or hole plating. The fingers are angularly disposed in a helical arrangement about the central axis of the socket to shorten the socket profile without reducing finger compliance.
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