| 摘要 |
An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.
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