| 摘要 |
PURPOSE:To obtain the title composition flexibilized without detriment to its electrical properties and being useful as a molding material for printed boards, etc., an adhesive or the like, by adding a curing agent and a specified flexibilizer to an uncured epoxy resin. CONSTITUTION:An epoxy resin composition prepared by mixing 100pts.wt. epoxy resin (A) [e.g., a resin of the formula (wherein n is 0 or an integer <=30)] with 0.5-500pts.wt. curing agent therefor (B) (e.g., 4,4'-diaminodiphenylmethane) and 1-100pts.wt. hydrogenated, hydroxylated liquid diene polymer (C) (e.g., a product obtained by hydrogenating a hydroxylated liquid polybutadiene in the presence of an Ru-containing hydrogenation catalyst). This composition is flexibilized without detriment to the electrical properties of the epoxy resin by using said flexibilizer and is useful as a molding material for printed boards, etc., an adhesive or the like.
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