| 摘要 |
PURPOSE:To eliminate the need to vary the size of fine grooves without reference to an increase or decrease in gas flow rate by shunting a gas flow to a by-pass passage and a main passage by one silicon chip. CONSTITUTION:The thin groove 2 for by-passing is formed in the silicon chip 1 by isotropic and anisotropic etching on the top surface side, and a thin groove 3 for the main passage is formed on the reverse surface side. Further, a through- hole which links the thin groove 2 and thin groove 3 with each other is formed. Further, a glass plate 6 equipped with a pipe insertion hole 5, pipes 7, and a detector 8 which analyzes and detects gas components from heat conductivity are arranged on the silicon chip 1. Then when a gas is injected from the pipe 7, the gas flows through the passages 2 and 3 and passes through the detector 8 to analyze the gas components, and the gas having passed through the passage 2 and the gas having passed through the passage 2 join each other and is discharged from the pipe 7.
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