| 摘要 |
PURPOSE:To make it possible to remove a heat radiating block readily and to facilitate replacement of electronic parts, by providing a heat conducting uncured silicone compound layer between a circuit board and the heat radiating block, and bonding the circuit board and the heat radiating block with a silicone rubber layer, which is provided at an outer surface part. CONSTITUTION:Electronic parts 1 are mounted on a circuit board 2. A heat radiating block 3 is provided on the rear surface of the circuit board 2. A heat conducting uncured silicone compound layer 4 is provided between the heat radiating block 3 and the circuit board 2. The outer surface part of the layer 4 is covered with a silicone rubber layer 5. The circuit board 2 and the heat radiating block 3 are bonded with the silicone rubber layer 5. When the heat radiating block 3 is removed for replacing the electronic parts 1, the silicone rubber layer 5 is cut with a knife so as to reach the heat conducting uncured silicone compound layer 4. Since the silicone compound layer 4 is uncured, the heat radiating block 3 can be readily removed, and the electronic parts can be replaced.
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