| 摘要 |
PURPOSE:To implement high reliability in soldering connection of a package, by providing surface mounting soldered terminals of a large flat package and the like, from which many outer connection leads are guided out, and forming lead terminals, which absorb the warping or snaking of a circuit board to be connected. CONSTITUTION:A soldered land ring 4 and a lead terminal 3 are connected. A paste state solder is applied on a connecting part by a specified amount in an assembled board beforehand. When the board is made to pass in a reflow heating furnace at a solder fusing point or higher, bumps 5 and 5 are formed. The lead terminal 3, which is guided out of a hybrid IC, is mounted on an electrode pattern 6 of a circuit board 8 facing the terminal 3 and temporarily fixed. Then, reflow heating is performed again, and the soldering is finished. At this time, the lead terminal 3 and the electrode pattern 6 are perfectly contacted at least at three points. Even if the remaining part of the terminal 3 faces the electrode pattern 6 through a fine gap, the lead terminal 3 sinks along the surface of the electrode pattern at the time of the soldering in the reflow heating furnace. Thus the secure soldering is ensured.
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