| 摘要 |
PURPOSE:To directly bond finely and densely electrode pads of semiconductor to electrode group on a mounting substrate with high reliability by forming projecting electrodes by a conventional nail head bonding technique on the pad of a semiconductor chip, and electrically connecting the chip on the substrate by a member having anisotropic conductivity from the electrode. CONSTITUTION:Thermal energy is applied to the end of a metal wire fed through a capillary 4 to be melted to form a ball 3. After the ball 3 formed in this manner is bonded by thermally press-bonding or ultrasonic bonding or both to the electrode pad 2 of an IC chip, the metal wire at the root of the ball 3 is cut to form projecting electrodes 5. Thus, after the electrodes 5 are formed all the pads 2 of the chip 6, the electrodes 5 of the chip 6 and ITO electrodes 9 on a glass substrate 8 are positioned through an anisotropically conductive film 7 having several ten mum thick, the chip 6 and the substrate 8 are press-bonded fixedly. Then, the chip 6 is electrically connected to the electrodes 9. |
