| 摘要 |
PURPOSE:To shorten the heating time of the pressing plate for soldering by heating the pressing plate of a soldering device at the time of the ascent of a ram and utilizing the elastic force of a plate spring so that a heated pressing plate may press a solder joining part at the descent time of the ram. CONSTITUTION:A movable part 7b is formed by provided a pair of notches 7c at the center part of the main body 7a of a plate spring 7 and when a rod 13 is located at the uppermost position, an upper restraining member 8 pressed the movable 7b in the lower direction and a pressing plate 6 is pressed to a heating body 4 with the elastic force of the plate spring 7 and heated at the specified temp. A base body 11 and soldering part 10 are located and when the ram 2 is descended by the rod 13, the movable part 7b is pressed in the upper direction by the lower restraining member 9, the pressing plate 6 is soldered with a snap motion and pressed to the joining part 14 of the part 10 to perform the soldering. When the ram 2 is ascended up to the intermediate point by the rod 13, the restraining member 8 does not come into contact with the plate spring 7, so the pressing plate 6 is cooled with pressing the soldering part 10.
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