| 摘要 |
PURPOSE:To improve the heat sink characteristic of a semiconductor chip by forming a heat sink soldering bump on a region except the electrode of the chip surface, forming a solder bump bonding region on a section except an electrically necessary position, and bonding the chip to a substrate even except the electrode. CONSTITUTION:Electrodes 42, 43 of aluminum films are formed on a semiconductor chip 41, electrically insulating films 42, such as SiO2 are formed except the electrodes, and a wiring solder bump 44 and heat sink only solder bump 45 are formed thereon. The bump uses a material having good wettability to Pb/Si solder, such as Cr/Cs, Ti/Ni in equal heights. A wiring circuit 53 and a film 54 to be bonded to the bump 45 are formed of aluminum, etc., on a mounting substrate 51, and electrically insulated by an insulating film 55 of SiO2 of polyimide resin, etc. A window for bonding the wiring/heat sink only bump is formed at the film 55. Accordingly, the heat of the chip can be efficiently dissipated.
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