| 发明名称 |
Package-on-Package Structures and Methods for Forming the Same |
| 摘要 |
A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound. |
| 申请公布号 |
US2016351554(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615231884 |
申请日期 |
2016.08.09 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Kuei-Wei;Lin Chih-Wei;Lin Hsiu-Jen;Lin Wei-Hung;Cheng Ming-Da;Liu Chung-Shi |
| 分类号 |
H01L25/00;H01L21/48;H01L21/56;H01L25/10 |
主分类号 |
H01L25/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
encapsulating a device die over a package substrate in an encapsulating material to form a first package, wherein a first electrical connector of the first package is exposed through a top surface of the encapsulating material; and removing a top portion of the first electrical connector using an electrical arc, wherein a bottom portion of the first electrical connector remains after the top portion of the first electrical connector is removed. |
| 地址 |
Hsin-Chu TW |
