PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION

摘要

In an electronic package that includes an electronic component, a method of forming one or more cavities in the electronic package includes depositing solder material on at least one terminal of the electronic component, encapsulating the electronic component and the solder material in an encapsulant, exposing a top surface of the solder material from the encapsulant, and removing the solder material such that a cavity remains at a location in the encapsulant where the solder material was removed. The solder material can be removed by a hot air solder removal process to yield one or more cavities having a consistent size and shape. In a package-on-package (PoP) process, solder balls on an active surface of another electronic package are positioned in the one or more cavities in alignment with the terminals, and the solder balls are attached to the terminals via solder reflow to produce a PoP device.

主权项

1. A method of forming a cavity in an electronic package, said electronic package including an electronic component, and said method comprising:
depositing solder material on at least one terminal of said electronic component; encapsulating said electronic component and said solder material in an encapsulant; exposing a top surface of said solder material from said encapsulant; and following said exposing operation, removing said solder material such that said cavity remains at a location where said solder material was removed, wherein said removing operation removes said top surface of said solder material and at least a portion of said solder material below said top surface to produce said cavity.