| 发明名称 |
METHOD FOR MANUFACTURING COMPONENT BUILT-IN SUBSTRATE |
| 摘要 |
A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body. |
| 申请公布号 |
US2016351471(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615138329 |
申请日期 |
2016.04.26 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SUWADA MAKOTO;YAMADA Mitsutaka;SUZUKI Masumi;AOKI Michimasa;Takemura Keizou;OKAMOTO Shinichirou;Katsumata Kenji;WEI JIE |
| 分类号 |
H01L23/473;H01L23/367;H01L23/04 |
主分类号 |
H01L23/473 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate comprising:
a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body. |
| 地址 |
Kawasaki-shi JP |
