| 摘要 |
PURPOSE:To perform test on a semiconductor device to be tested with a high reliability in terms of temperature by providing part of a test head to which the semiconductor device to be tested is mounted with a heater for setting the semiconductor device to a desired temperature. CONSTITUTION:A printed circuit board 1 constituting a test head is provided with a socket 3 for mounting a semiconductor device 2 to be tested and a heater 4 for heating the semiconductor device 2. The heater 4 is formed such that the bottom surface of the semiconductor device 2 to be tested and the surface of the heater 4 are brought into contact with each other in a condition wherein the semiconductor device 2 is mounted to the socket 3. The heater 4 is heated to be set to a prescribed temperature in accordance with the test condition of the semiconductor device 2. As a result, the semiconductor device 2 mounted to the socket 3 for a test is held at the prescribed temperature in accordance with the test condition whereby highly reliable test can be performed.
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