| 摘要 |
PURPOSE:To conduct processes up to a resin molding process from a bonding process continuously and automatically, to remove the retention of a lead frame and to perform quick resin seal treatment by mounting a mold, to which one cavity is formed, and a resin sealing device sealing semiconductor element sections after the completion of bonding with a molding resin one by one. CONSTITUTION:A lead frame 25 carried out of a loader side magazine is forwarded to the lower position of a bonding head by the operation of a feed- pawl 28, and electrode sections for semiconductor elements 26 and lead sections for the lead frame 25 are bonded at the lower position of the bonding head. When a semiconductor element 26 section being at the head of the lead frame 25 is carried to the predetermined position of a bottom force 3, the inside of a pot 8 is supplied with a resin 9 by a resin feed mechanism 10, and a top force 2 is lowered by each cylinder 5, 5 while the bottom force 3 is elevated and each force 2, 3 is closed. A plunger 11 is lifted, the resin 9 is injected into a cavity 4 through a cull section 27 and a runner gate section 7, and the top force 2 is raised after a fixed time passes.
|
