| 摘要 |
PURPOSE:To make it possible to attach surely a lead frame to a substrate, and increase the mounting efficiency of a substrate surface, by forming, on the side part of the substrate, a cavity into which the end-portion of the lead frame can be inserted from the transversal direction of the substrate. CONSTITUTION:A substrate 11 constitutes a printed wiring board 10 for semiconductor mounting which is mounted on another substrate via a lead frame 12. On a side part of the substrate 11, a cavity 16 is formed into which on end- portion 12a of the lead frame 12 can be inserted from the transversal direction of the substrate 11. For example, the above substrate 11 is constituted in the manner in which a plurality of materials formed separately are mutually combined via an insulating layer 15 and unified in a body. In this case, necessary conductor circuits 13 are previously formed, which are electrically connected with each through hole 14 formed on the substrate 11. The lead frame 12 connects a semiconductor element 30 mounted on the surface of the substrate 11 and conductor circuits on another substrate on which the printed wiring board 10 for semiconductor mounting is arranged.
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