| 摘要 |
PURPOSE:To prevent the short between multilayer interconnections and the disconnection of wirings by a method wherein the surface of a first layer wiring is coated with a conductor film, a buried conductor is buried in a hole formed in an insulating film and a second layer wiring is brought into contact to this buried conductor. CONSTITUTION:A conductor film 7 is formed on the surface of a first layer wiring 3, an insulating film 8 is formed in such a way as to cover the formed conductor film 7, then a hole provided with the conductor film 7 as its bottom is formed in the formed insulating film and after that, a buried conductor 10 is buried in this formed hole and a second layer wiring 11 is formed in such a way as to come into contact to this buried conductor 10. Thereby, the short between the multilayer interconnections due to a hillock and the disconnection of the wirings due to a step coverage failure can be prevented.
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