| 发明名称 |
Highly heat-sensitive film for stencil |
| 摘要 |
The present invention relates to a highly sensitive heat-sensitive film for stencil. This invention provides a highly heat-sensitive film for stencil, comprising a thermoplastic resin having a coefficient of temperature and melt viscosity ( DELTA T/ DELTA log VI) of not more than 100 and a thermal shrinkage (X%) at 100 DEG C. and a thermal shrinkage stress (Y g/mm2) at 100 DEG C. falling respectively in the ranges of the formulas; 15</=X</=80 and 75</=Y</=500; and both falling in the range of the formula; -8X+400</=Y</=-10X+1000; having a thickness in the range of 0.5 to 15 mu m, and excelling in low-energy perforation property. The film of this invention is superior in a low temperature perforation property, capable of being perforated with a low energy thermal head or with a low energy flash irradiation for making a plate; expansion of perforations is small when the film is perforated; and its change with time (dimensional change) is small and its sizes are stable.
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| 申请公布号 |
US4766033(A) |
申请公布日期 |
1988.08.23 |
| 申请号 |
US19860885210 |
申请日期 |
1986.07.14 |
| 申请人 |
ASAHI KASEI KOGYO KABUSHIKI KAISHA |
发明人 |
YOSHIMURA, ISAO;NAKAO, TAKASHI;KOHNO, MITSUO |
| 分类号 |
B32B5/02;B41N1/24;D06M17/00;(IPC1-7):B32B27/06;B41C1/14 |
主分类号 |
B32B5/02 |
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