| 摘要 |
PURPOSE:To suppress side etching of low resistance films and to permit formation of thicker and finer coils by laminating plural layers of the low resistance films via metallic protective films and subjecting the low resistance films successively to photoetching from the upper layers with the protective films on the side faces as masks. CONSTITUTION:After an insulating film 2 is formed on a magnetic substrate 1 consisting of ferrite, etc., a 1st low resistance film 3 is formed thereon. The metallic protective film 5 consisting of Cr, etc., and the 2nd low resistance film 6 are formed thereon, and after a photoresist 4 coated thereon is patterned, the 2nd low resistance film 6 is patterned to a coil shape by chemical etching with the photoresist 4a as a mask. The side face protective film 7 is formed on the side face of the 2nd low resistance 6a and with the 2nd low resistance film 6a as a mask, the metallic film 5 is removed so that only the lower part 5a remains. The 1st low resistance film 3 is patterned by chemical etching with the remaining protective film 5a as a mask and finally the photoresist 4a is removed. Generation of the side etching is thereby suppressed and the fine coils having a large film thickness are formed.
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