| 摘要 |
PURPOSE:To shorten the time required to degas a plastic substrate when a film is formed on the substrate in a vacuum thin film producing device, by dividedly removing gas such as moisture from the substrate in a degassing device and the thin film producing device. CONSTITUTION:A plastic substrate having a high water content is set on No.1 tray 3. The tray 3 is put in the loading chamber 28 of a vacuum degassing device 1 and becomes No.2 tray 4. Trays are successively put in the device 1 every beat time and the tray 4 becomes No.3 tray 5. No.97 tray 6 degassed at a prescribed degree of vacuum for a prescribed time enters the unloading chamber 29 and becomes No.98 tray 7. The tray 7 is taken out of the device 1 and becomes No.99 tray 8. The tray 8 is put in the loading chamber 15 of a sputtering device 2 within 3min and becomes No.100 tray 9. After the chamber 15 is evacuated to a prescribed degree of vacuum in a prescribed time, the tray 9 is transferred to a sputtering chamber 16 and becomes No.101 tray 10. In the chamber 16, a film is formed at a prescribed degree of vacuum. The tray 10 is further transferred to sputtering chambers 17, 18 in succession, films are formed and the tray is taken out of the device 2 through the unloading chamber 19.
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