发明名称 ELEMENT SUPPORT STRUCTURE OF ELECTRONIC COMPONENT
摘要 PURPOSE:To improve the mechanical strength of component support structure by providing a base formed incorporatedly with a lead and projecting at least one tip of the leads from the base and folding it in a way of clipping the component. CONSTITUTION:The component 16 is inserted to a slot of a synthetic resin made base 15 formed incorporatedly with three leads 12, 13, 14, the tip 24 of the lead 13 is folded and its tip is in contact with the electrode 26. Then, the electrode 26 and the tip 24 are soldered to solder an electrode 27 and the leads 12, 14. Thus, even when an external stress is exerted to the lead, the stress is not propagated to the component 16 and the soldered part is not easily peeled and the component is supported surely, then the mechanical strength is improved.
申请公布号 JPS63222508(A) 申请公布日期 1988.09.16
申请号 JP19870057748 申请日期 1987.03.12
申请人 MURATA MFG CO LTD 发明人 YAMAMOTO TAKASHI
分类号 H03H9/17 主分类号 H03H9/17
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