摘要 |
PURPOSE:To prevent cracks to be generated at the time of manufacturing and packaging by arranging a piezoelectric element in a base case, fixing a lead wave to the base case, and accommodating the base case into a package case. CONSTITUTION:The paper-tablet shaped piezoelectric element 2 with an electrode formed thereto is arranged in the rectangular frame shaped base case 3. Then the upper lead of a lead 4 is soldered to the case 3 by heating. Then the case 3 is accommodated into the package case 5 to seal the opening 5a of the case 5 by the resin. Through the constitution above, the shock at the time of manufacturing exerted to the lead wire 4 and an external force at the mount are absorbed by the case 3 and scarcely act onto the element 2. Thus, the occurrence of cracks is prevented. Since the opening 5a of the case 5 is sealed by the resin, the resin package is omitted and the manufacture time is reduced.
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