| 摘要 |
PURPOSE:To prevent the occurrence of short-circuit defects due to contact of leads between neighboring semiconductor elements in packaging, by providing an insulating film at the side surface part of a lead part. CONSTITUTION:An insulating film 4, which is provided on the side surface part of a lead part 2, can be applied to a lead frame from the beginning, or can be applied after the lead part is bent in a J shape, or can be applied at an appropriate stage among these steps. The insulating film is formed by applying a heat resisting resin such as polyimide or sticking a film. Since the insulating film 4 is formed on the side surface of the lead part 2, short-circuit defects can be prevented even if leads come into contact between neighboring semiconductor elements when a plurality of the elements are mounted on a wiring board such as a PC board. It is sufficient that the insulating film 4 is applied to the outer side surface of the lead part 3. Furthermore, the film can be applied to the edge surfaces on both sides and also can be applied to the inner side surfaces.
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