| 摘要 |
PURPOSE:To reduce a bonding pressure, a heating temperature or the like sufficiently and to enhance the reliability of a bonding operation by a method wherein a groove is made at the tip part of a bonding tool and a bonding part between a semiconductor chip and a lead at a circuit board is vibrated uniformly. CONSTITUTION:An electrode of a semiconductor chip 13 and a lead at a circuit board are bonded collectively. During this operation, a groove 19 whose shape corresponds to that of a lead 22 is made at the tip part of a bonding tool 15 to press the lead 22 onto the electrode; a vibrating mechanism 17 is installed to relatively vibrate this bonding tool 15 and a specimen stage 11 where the semiconductor chip 13 is placed. Because the lead 22 at the circuit board is supported by the groove 19, it is possible to prevent the lead from sliding during a vibrating operation. Accordingly, it is possible to uniformly vibrate a neighboring part of the bonding part during a bonding process; it is possible to reduce a bonding pressure and a heating temperature by means of this vibrating energy; it is possible to execute a highly reliable bonding operation.
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