| 摘要 |
PURPOSE:To improve the heat resistance of a diaphragm and to shorten time required for adhension process by executing the pressurized adhension of a piezo-electric ceramic board and a vibration substrate under the state of heating them. CONSTITUTION:After the liquid of anaerobic ultraviolet rays curing resin is coated on the surface of the vibration substrate 4 as an adhensive agent, the piezoelectric ceramic board 3 is mounted in a superimposed state and the pressurized adhension of the vibration substrate 4 and the piezo-electric ceramic board 3 is executed under fixed pressure by lowering an upper mold 10 on the board 3. When the adhensive agent 5 is cured, the upper mold 10 is lifted and a piezo-electric diaphragm 1 after the joining of the board 3 and the substrate 4 is taken out. Then the surface of the uncured adhensive agent 5 forced out and disclosed out of the circumferential edge of the ceramic board 3 is irradiated by ultraviolet rays and the curing process of it is executed. At the time of the pressurized adhension, the heating temperature of a lower mold (not shown in a figure) and the upper mold 10 is suitably adjusted to obtain desired resonance frequency. Thus the mass production of a uniform product can be realized by adding the heat resistance and reducing the irregulaity of the resonance frequency with the fixed control of the heating temperature.
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